SFP-T光模塊外殼

1.應(yīng)用于光纖通訊收發(fā)模塊SFP、SFP-T光模塊外殼、電口模塊外殼SFP+、SFF、GBIC等。鋅合金具有優(yōu)良的鑄造性能、力學(xué)性能、韌性，而且還具有優(yōu)良的電和熱傳導(dǎo)性能，良好的振動(dòng)阻尼特性，良好的電磁屏蔽性能，因此在電子、電訊、家電產(chǎn)品上應(yīng)用不斷增長(zhǎng)，尤其是需要解決電磁屏蔽問(wèn)題的電子產(chǎn)品。 
2.精密模具,采用進(jìn)口鋼材，高精密設(shè)備加工，設(shè)計(jì)科學(xué)，制作精良
3.壓鑄成型，高精密壓鑄機(jī)，參數(shù)化控制，保證產(chǎn)品尺寸穩(wěn)定、精度高、一致性好,表面質(zhì)量好，良品率高。
4.柱子鍍金，保證良好的可焊性，可解決物料存放周期長(zhǎng)，而導(dǎo)致柱子焊接不上。
5.表面鍍層，良好的耐磨、耐酸堿腐蝕（96小時(shí)鹽霧測(cè)試）、耐高低溫（96小時(shí)UBPPT測(cè)試、150度1小時(shí)高溫/100度4小時(shí)、8小時(shí)蒸汽老化測(cè)試）
6.產(chǎn)品符合RoHS要求,可提供ICP/SGS報(bào)告
7.生產(chǎn)工藝：壓鑄--沖壓--去毛刺--噴砂--電鍍,采用流續(xù)流生產(chǎn)模式，日產(chǎn)能5kpcs/線
8.公司實(shí)驗(yàn)室有RAC紙帶耐磨測(cè)試儀、蒸汽老化測(cè)試、高溫高壓測(cè)試儀UBPPT（雙85加速測(cè)試）等
9.公司測(cè)量室有2.5次元測(cè)量?jī)x、內(nèi)外徑千分尺、高度千分尺、硬度計(jì)、推拉力計(jì)、扭力計(jì)等
10.運(yùn)用先進(jìn)的品質(zhì)管控工具：FAI、SPC、CPK、GR&R  。 光纖收發(fā)模塊支架。1. The application in optical fiber communication transceiver module SFP, SFP +, SFF, GBIC, etc. Zinc alloy with excellent casting performance, mechanical properties, toughness, but also good electrical and heat conduction performance, good vibration damping characteristics, and good electromagnetic shielding performance, so in electronics, telecommunications and electrical appliances product application is growing, especially need to solve the problem of electromagnetic shielding of electronic products.
2. Precision mould, using imported steel, high precision equipment processing, design science, well made
3. Die-casting forming, high precision casting, parameter control, so as to ensure product size stability, high precision, good consistency and good surface quality, high yield.
4. Their gold-plated, ensure good weldability, which can solve the material storage cycle is long, and cause their welding.
5. Surface finishes, good resistance to abrasion, naisuanjian corrosion (96 hours salt spray test), high and low temperature resistance (96 hours UBPPT testing, 150 degrees 1 hour high temperature / 100 degrees 4 hours, 8 hours steam aging test)
6. Products comply with RoHS request, can provide ICP/SGS report
SFP-T光模塊外殼